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Technical Sponsor: |
SISPAD 2015 Committees
Organizing Committee
| Conference Chair | Neil Goldsman (University of Maryland) | |
| Technical Committee Chair | Mark Stettler (Intel Corporation) |
Honorary Committee
| R. Dutton (Stanford University, USA) | |
| S. Selberherr (Technical University of Vienna, Austria) | |
| K. Taniguchi (Osaka University, Japan) |
International Steering Committee
| A. Asenov (University of Glasgow, UK) | |
| V. Axelrad (Sequoia Design Systems, USA) | |
| N. Goldsman (University of Maryland, USA) | |
| J. Lorenz (FhG Erlangen, Germany) | |
| K. Matsuzawa (Toshiba Corporation, Japan) | |
| N. Mori (Osaka University, Japan) | |
| M. Rudan (University of Bologna, Italy) | |
| K. Sonoda (Renesas Electronics Corp., Japan) | |
| M. Stettler (Intel Corporation, USA) |
Technical Program Committee
| Akin Akturk (U. of Maryland, College Park) | Campbell Millar (Gold Standard Simulations) | |
| Roksana Golizadeh (Intel Corp.) | Chandra Mouli (Micron Technology) | |
| Tibor Grasser (Technical U. of Vienna) | Victor Moroz (Synopsys) | |
| Tom Herrmann (GLOBALFOUNDRIES) | Phil Oldiges (IBM) | |
| Akira Hiroki (Kyoto Inst. of Technology) | Frank Register (University of Texas, Austin) | |
| Gerhard Klimeck (Purdue U.) | Massimo Rudan (University of Bologna) | |
| Irena Knezevic (U. of Wisconsin) | Pankaj Shah (Army Research Laboratory) | |
| Takashi Kurusu (Toshiba) | Kenichiro Sonoda (Renesas) | |
| Uihui Kwon (Samsung) | Clement Tavernier (ST Microelectronics) | |
| Chung-Kai Lin (TSMC) |
Publication Chairs
| Z. Dilli (CoolCAD Electronics, LLC) | |
| C. Korman (George Washington University) |
Local Activities Committee
| Z. Dilli (CoolCAD Electronics, LLC) |