Conference Committee: Steering Chair:Liaison: M. Miura-Mattausch (Hiroshima Univ.) Honorary Committee: R. Dutton (Stanford Univ., USA) S. Selberherr (TU Wien, Austria) K. Taniguchi (Osaka Univ., Japan) International Steering Committee: A. Asenov (Univ. of Glasgow, UK) V. Axelrad (Sequoia Design Systems, USA) D. Esseni (Univ. of Udine, Italy) N. Goldsman (Univ. of Maryland, USA) J. Lorenz (Fraunhofer IISB, Germany) K. Matsuzawa (Toshiba, Japan) N. Mori (Osaka Univ., Japan) L. F. Register (Univ. of Texas at Austin, USA) K. Sonoda (Renesas, Japan) | Program Committee: Chair: Vice-Chair: T. Kurusu (Toshiba) Members: Z. Dilli (CoolCAD Electronics LLC) K. Eikyu (Renesas) D. Esseni (Univ. of Udine) T. Grasser (TU Wien) H. Hayashi (Lapis Semiconductor) C. Kaneta (Fujitsu Laboratories Ltd.) I. Knezevic (Univ. Wisconsin, Madison)U. Kwon (Samsung) Y. Li (National Chiao Tung Univ.) C.-K. Lin (TSMC) J. Lorenz (Fraunhofer IISB) C. Millar (GSS) H. Minari (Sony) V. Moroz (Synopsys) D. Navarro (Hiroshima Univ.) P. Oldiges (IBM) L. F. Register (Univ. of Texas at Austin) D. Rideau (STMicroelectronics) A. Schenk (ETH Zurich) M. Uematsu (Keio Univ.) |