 Sponsored by The Japan Society of Applied Physics Technical Co-sponsored by The IEEE Electron Device Society Important Dates : International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge
research and development results in the area of process and device
simulation. SISPAD is one of the longest-running conferences devoted to
technology computer-aided design (TCAD) and advanced modeling of novel
semiconductor devices and nano electronic structures.
The 22nd SISPAD will be held on September 7-9, 2017 in Kamakura, Japan. News : Sept. 4, 2017 Access has been updated. July 18, 2017 Technical Program is available here. May 12, 2017 List of the invited speakers is available here. Apr. 12, 2017 Information of Workshops has been updated. Apr. 10, 2017 Abstract submission deadline has been re-extended. Mar. 29, 2017 Abstract submission deadline has been extended. Feb. 24, 2017 List of the plenary speakers is available here. Jan. 20, 2017 The SISPAD abstract submission site is now open. |
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